SealTekPro KD32 transparent Pressure Sensitive Adhesive (PSA) cover tape is engineered specifically for the precision packaging of FPC, IPX, IPEX, and HSC series connectors, SMD components, and discrete microelectronics. Featuring superior optical transparency and a double-sided high surface resistivity (10¹² Ω/cm²), KD32 satisfies demanding packaging requirements for automated optical inspection (AOI), visual defect checking, and surface insulation protection. It bonds instantly at room temperature under roller or pressure-bar sealing without thermal energy, delivering reliable component retention, stable fluctuation-free peel force, and clean residue-free removal on high-speed SMT packaging lines.
Product Highlights
- High Optical Clarity for AOI Vision: High-transparency PET film facilitates visual and Automated Optical Inspection (AOI), allowing precise verification of component presence, marking, and orientation without tape removal.
- Double-Sided High Surface Resistivity (10¹² Ω/cm²): Engineered with uniform 10¹² Ω/cm² high resistance on both adhesive and backing sides, providing dependable electrical insulation protection for sensitive connector contacts.
- Room-Temperature Cold Bonding: Pressure-sensitive adhesive bonds instantly under mechanical pressure at room temperature, eliminating machine pre-heating/cooling waiting time and safeguarding heat-sensitive components.
- Compliant with EIA-481-F Standards: Fully compliant with EIA-481-F and IEC 60286-3 specifications, ensuring smooth, fluctuation-free peel force (20–130 gf) and zero tape tearing or residue on high-speed pick-and-place lines.
- Residue-Free & Halogen-Free: Clean peel-off leaves zero adhesive transfer on carrier rails or electrical contact points, fully compliant with RoHS 2.0, REACH, and halogen-free green supply chain standards.