KD568FTS transparent HAA cover tape is suitable for packaging memory chips such as ROM and RAM, as well as CMOS, SOI, and 3D stacking communication chips. Its transparency facilitates visual inspection during the packaging process, while its diverse SR of film and adhesive side design improves compatibility with chips. Its efficient heat-sealing properties ensure a tight and stable packaging, providing strong support for chip packaging quality and efficiency.
Product Highlights
- Compliant with EIA-481-F standards: Strictly engineered in compliance with EIA-481-F specifications to ensure seamless compatibility with automated high-speed taping systems and downstream de-taping equipment.
- Excellent weather resistance and environmental adaptability: Maintains stable sealing and physical performance across fluctuating temperature and humidity conditions, adapting reliably to complex transport and storage.
- Smooth and stable peel force: Delivers consistent, fluctuation-free peel strength during high-speed de-taping, eliminating pocket vibration and protecting sensitive electronic components from damage.
- Halogen-free and eco-friendly: Fully compliant with global environmental directives (RoHS 2.0 / REACH), meeting green supply chain requirements for clean semiconductor packaging.